F&K M17LSB ULTRASONIC LASER BONDER WIRE USED

Product Specifications

• Model: F & K Delvotec M17LSB Ultrasonic Laserbonder

• Laser Type: Pulsed (DPSS or fiber)

• Wavelength Options:

  • ~Standard: 1064 nm (Nd:YAG)

  • ~Optional: 532 nm (green), 355 nm (UV)

• Laser Power:

  • ~Up to 100 W max output (varies by configuration)

  • ~Adjustable pulse energy and duration

• Pulse Duration: Microsecond range

• X/Y Travel Area: Up to 300 mm x 300 mm

• Z-Axis Clearance: Approx. 80 mm (configurable)

• Bonding Speed: 1–3 bonds per second

• Laser Dwell Time: 100–300 ms per bond

• Notable Condition Detail: Damaged key switch

Key Features

• Hybrid ultrasonic and laser bonding for enhanced material versatility

• Microsecond-level energy control for fine-pitch bonding precision

• Wide-area support for larger or complex assemblies

• Advanced vision and calibration tools reduce cycle times

• Multiple laser wavelengths for broad material compatibility

• Supports aluminum, copper, nickel, and specialty alloys

• Ideal for production-scale or prototyping environments

Applications

• Battery tab bonding for EV, power tools, and energy storage

• Wire bonding and die attachment in semiconductor fabrication

• Precision micro-welding for medical and aerospace devices

• High-density PCBs and power modules

• Advanced research labs needing precision bonding solutions