F&K M17LSB ULTRASONIC LASER BONDER WIRE BONDER USED

Product Specifications

• Model: F & K Delvotec M17LSB Ultrasonic Laserbonder

• Laser Type: Pulsed laser (DPSS or fiber-based)

• Supported Wavelengths:

  • ~Standard: 1064 nm (Nd:YAG)

  • ~Optional: 532 nm (green), 355 nm (ultraviolet)

• Laser Power:

  • ~Up to 100 W (depending on module)

  • ~Adjustable pulse energy and duration

• Pulse Duration: Microsecond range, precision configurable

• X/Y Travel Area: Up to 300 mm x 300 mm

• Z-Axis Clearance: Supports parts up to approx. 80 mm tall

• Bonding Speed: 1–3 bonds per second

• Laser Dwell Time: 100–300 milliseconds per bond

Key Features

• Ultrasonic + laser bonding capability for versatile bonding solutions

• Microsecond pulse modulation for precise thermal control

• Wide-area bonding support with 300 x 300 mm travel

• Advanced automation features including fiducial recognition and auto-calibration

• Flexible wavelength options for bonding different materials

• Robust pattern recognition system improves alignment and accuracy

• Configurable for a wide range of applications, from fine wires to structural tabs

Applications

• Battery tab bonding in EVs and power storage systems

• Wire bonding for semiconductor and LED assembly

• Photovoltaic module production requiring precision interconnects

• Hybrid electronics and medical device bonding

• Precision welding in aerospace-grade microelectronics