F&K DELVOTEC M17LSB ULTRASONIC LASER BONDER USED GREAT SHAPE

Product Specifications

• Model: F & K Delvotec M17LSB

• Laser Type: Pulsed laser (DPSS or fiber laser)

• Wavelengths Supported:

  • ~Standard: 1064 nm (near-infrared, Nd:YAG)

  • ~Optional: 532 nm (green), 355 nm (ultraviolet)

• Laser Power:

  • ~Up to 100 W (depending on configuration)

  • ~Adjustable pulse energy and duration

• Pulse Duration: Microsecond range

• Bonding Area (X/Y): Up to 300 mm x 300 mm

• Z-Axis Clearance: Approx. 80 mm (configurable)

• Speed: 1 to 3 bonds per second

• Dwell Time: 100–300 ms per bond

Key Features

• Configurable laser wavelengths for material-specific bonding

• High-precision pulse control enables microsecond energy delivery

• Large work envelope supports components up to 300 x 300 mm

• Automated fiducial recognition and calibration for rapid setup

• Vision-guided operation ensures bonding accuracy and consistency

• Optimized for fine-pitch, high-density interconnects

• Capable of welding various materials including copper, aluminum, and nickel

Applications

• Battery tab welding in EVs and consumer electronics

• Semiconductor bonding for high-density packages

• Photovoltaic and power module assembly

• Medical device micro-welding

• Precision laser soldering in aerospace and defense