F&K DELVOTEC M17LSB ULTRASONIC LASER BONDER

Product Specifications

• Model: M17LSB
• Bonding Method: Ultrasonic and laser hybrid bonding
• Bond Head Type: Multi-axis precision wire bonding head
• Wire Types Supported: Gold, aluminum, copper
• Wire Diameters: Supports a wide range of diameters for various applications
• Bonding Modes: Ball, wedge, and laser-stitch options
• Control Interface: Integrated touchscreen with programmable software
• Vision System: High-resolution optical alignment for target accuracy
• Power Requirements: Standard industrial power configurations
• Dimensions: Compact footprint optimized for lab or production floor use

Key Features

• Combines ultrasonic and laser bonding in a single platform
• High-speed, high-accuracy bonding performance
• Advanced pattern recognition and optical alignment system
• Versatile wire compatibility for multiple interconnect strategies
• Customizable bond parameters for varying material and package types
• Durable frame with vibration isolation for precision bonding
• User-friendly programming environment for efficient operation
• Ideal for R&D, prototyping, and volume production environments

Applications

• Semiconductor chip packaging
• Power electronics interconnects
• Automotive sensor and module assembly
• RF and microwave device bonding
• Medical device micro-assembly